Clextral at Fispal Technologia 2014

fispal tecnologia 2014From the 3rd to the 6th of June, Clextral will be exhibiting at the 30th edition of Fispal, in São Paulo, Brazil, Stand D137.

Come meet our staff at Fispal the largest fair in Latin America for the packaging industry, process and logistics for food and beverages.

Learn about Clextral latest innovations such as the New EVOLUM+, the New Preconditioner or the Sweet Coating System. Our team will be there to give you the information you need about twin screw extrusion and drying technologies to produce breakfast cereals, snacks, multigrain chips, pasta, couscous and more.

Looking forward to see you on Stand D137!

To learn more, visit Fispal website www.fispaltecnologia.com.

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